
www.vishay.com For technical questions, contact: die-wafer@vishay.com
Document Number: 93899
2 Revision: 28-Mar-08
VS340LM..CS05CB Series
Vishay High Power Products
Fast Recovery Diodes
ORDERING INFORMATION TABLE
Device code
1 - Vishay HPP device
2 - Chip dimension in mils
3 - Type of device: L = Wire bondable fast recovery diode
4 - Passivation process: M = Glassivated MOAT
5
- Voltage code x 100 = V
RRM
6
- Metallization: C = Aluminum (anode) - silver (cathode)
7 -t
rr
code: S05 = 500 ns
8 - CB = Probed uncut die (wafer in box)
None = Probed die in chip carrier
Available class
10 = 1000 V
12 = 1200 V
51324678
VS 340 L M 12 C S05 CB
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95128
Kommentare zu diesen Handbüchern